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preliminary data sheet
SKY65152: 2.4-2.5 GHz WLAN Power Amplifier
Applications
IEEE802.11 b/g WLAN ISM band transmitter l WCS fixed wireless l Wireless access nodes
l l
Block Diagram
VREF1 VC_BIAS RREF1 VREF2 PA_ENB VREF3 VCC_DET RREF2 RREF3
Active Bias Interstage Match VCC1 VCC2 Interstage Match
Detector
V_DET
Features
EVM < 3% for POUT > 27 dBm l High gain: 31 dB l Internal RF match with DC block and active bias circuits l Internal ON/OFF control circuit l Single DC supply: 5 V l Operating temperature -40 C to +85 C l Available on tape and reel l Available lead (Pb)-free and RoHs-compliant l MCM (20-pin, 6 x 6 mm) lead (Pb)-free package (MSL-3 @ 260 C per JEDEC J-STD-020)
l
RF In
Input Match
Output Match
RF Out
VCC3
Package Diagram
RF_IN GND GND GND
GND GND PA_ENB VC_BIAS VREF1 VREF2
1 2 3 4 5 6
20
19
18
17
16 15 14 13 12
VCC1 VCC_DET V_DET VCC2 N/C VCC3
Description
Skyworks SKY65152 is a Microwave Monolithic Integrated Circuit (MMIC) Power Amplifier (PA) with superior output power, linearity, and efficiency. These features make the SKY65152 ideal for Wireless Local Area Network (WLAN) applications. The high linearity (low EVM) and high efficiency of this device makes it ideal for use in the transmit chain of WLAN access point or modems. The SKY65152 is fabricated using Skyworks high reliability Aluminum (Al) Gallium Arsenide (GaAs) Heterojunction Bipolar Transistor (HBT) process, which allows for single supply operation while maintaining high efficiency and good linearity. The device is internally matched and mounted in a 20-pin, 6 x 6 mm Multi-Chip Module (MCM) Surface-Mounted Technology (SMT) package, which allows for a highly manufacturable low cost solution. The module can operate over the temperature range of -40 C to +85 C. A populated evaluation board is available upon request.
7 VREF3
8 GND
9 RF_OUT
10 GND
11
neW
Skyworks offers lead (Pb)-free, RoHS (Restriction of Hazardous Substances)-compliant packaging.
preliminary data sheet: Based on engineering results. Sampling quantities available. Pin out and package have been determined.
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200968 Rev. C * Skyworks Proprietary Information * Products and Product Information are Subject to Change Without Notice. * March 26, 2009
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preliminary Data Sheet * SKY65152
Electrical Specifications
VCC1 = VCC2 = VCC3 = VREF1 = VREF2 = VREF3 = VC_BIAS = VCC_DET = PA_ENB = 5 V, ZO = 50 W, TC = 25 C, Frequency = 2.442 GHz, unless otherwise noted(5)
parameter symbol Condition min. typ. 1070 31 Output power set to POUT Small signal 23 <0.5 970 30 Output power set to POUT Output power set to POUT PIN = -25 dBm From 2.4 GHz to 2.5 GHz Over any 16.25 MHz within band POUT/tone = 23 dBm, DF = 5 MHz No RF @ P1 dB Junction to case 3 PA_ENB = 0 V 27 20 31 0.5 0.1 33 42 465 5 33 20 5 0 5 0.5 max. Unit mA dBm % s mA dBm dBm % dB dB dB dBm dBm mA dB % C/W V V A IEEE802.11b Complimentary Code Keying Input Signal, Data Rate = 11 Mbps Total supply current ICC_total Output power set to POUT Output power(1) Power-added efficiency(2) Ramp-up/ramp-down(3) POUT PAE TS
IEEE802.11g Orthogonal Frequency Division Multiplexing Input Signal, Data Rate = 54 Mbps Total supply current ICC_total Output power set to POUT Output power(4) efficiency(2) POUT POUT_EVM PAE G POUT POUT_EVM P1 dB OIP3 ICCQ NF PAE qJC PA_ENB On PA_ENB Off ISB Output power @ EVM=2.5% Power-added
Continuous Wave Input Signal Small signal gain Gain flatness over band Gain flatness over channel (16.25 MHz) Output power @ 1 dB compression Output IP3 Quiescent current Noise figure Power-added efficiency Thermal resistance Power Up/Down Control Power up Power down Standby current
1. Defined as the maximum power level for which the IEEE802.11b transmit mask requirements are met. 2. Measured at the specified average output RF power and modulation type. 3. Ramp-up and ramp-down times are defined from the 10% to 90% power points. 4. Defined as the maximum power level for which the IEEE802.11g transmit mask requirements are met. 5. Voltage measured at evaluation board pins.
Recommended Operating Conditions
parameter RF input power Supply voltages(1) Reference voltage(1) Detector supply voltage(1) Operating frequency Operating case temperature
1. Voltage levels measured at the pins of the package. The evaluation board supply voltage levels may be different. Refer to the evaluation board schematic diagram.
symbol PIN VCC, VC_BIAS VREF VCC_DET FO TC
min.
typ. 5.0 2.5 3.6
max. -3
Unit dBm V V V
2412 -40 +25
2462 +85
MHz C
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preliminary Data Sheet * SKY65152
Absolute Maximum Ratings
Characteristic RF output power (POUT) Supply voltage (VCC, VC_BIAS and PA_ENB)1 Supply current (ICC) Reference voltage (VREF)1 Detector supply voltage (VCC_DET)1 Power dissipation (PDISS) Operating case temperature (TC) Storage temperature (TST) Junction temperature (TJ) Value 28 dBm 5.5 V 850 mA 4V 4V 1.1 W -40 C to +85 C -55 C to +125 C 150 C
1. Voltage levels measured at the pins of the package. The evaluation board supply voltage levels may be different. Refer to the evaluation board schematic diagram. Performance is guaranteed only under the conditions listed in the specifications table and is not guaranteed under the full range(s) described by the Absolute Maximum specifications. Exceeding any of the absolute maximum/minimum specifications may result in permanent damage to the device and will void the warranty. Each absolute maximum rating listed is an individual parameter. Operating the amplifier with more than one condition at its absolute maximum or minimum rating value may result in permanent damage to the device. Exposure to maximum rating conditions for extended periods may reduce device reliability.
CAUTION: Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times.
Electrical Specifications
VCC1 = VCC2 = VCC3 = VREF1 = VREF2 = VREF3 = VC_BIAS = VCC_DET = PA_ENB = 5 V, ZO = 50 W, TC = 25 C, CW, Frequency = 2.442 GHz, unless otherwise noted
Gain vs. Power Out Across Frequency
Small Signal Gain vs. Frequency
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200968 Rev. C * Skyworks Proprietary Information * Products and Product Information are Subject to Change Without Notice. * March 26, 2009
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preliminary Data Sheet * SKY65152
Electrical Specifications
VCC1 = VCC2 = VCC3 = VREF1 = VREF2 = VREF3 = VC_BIAS = VCC_DET = PA_ENB = 5 V, ZO = 50 W, TC = 25 C, CW, Frequency = 2.442 GHz, unless otherwise noted
4.0 3.5 2442 MHz 2412 MHz 2462 MHz 1200 1000 ICC1 ICC2 ICC3 Total
Current (mA)
3.0
800 600 400 200 0 12 14 16 18 20 22 24 26 28 30 32
EVM (%)
2.5 2.0 1.5 1.0 17 18 19 20 21 22 23 24 25 26 27 28 29
POUT (dBm)
POUT (dBm)
eVm vs. pOUt across Frequency
Current vs. pOUt
Spectral Response @ POuT = 30 dBm (802.11g, OFDM, 64 QAM @ 54 Mbps)
Spectral Response @ POuT = 31 dBm (802.11b, CCK @ 11 Mbps)
PAE vs. POuT
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preliminary Data Sheet * SKY65152
Theory of Operation
The SKY65152 is a three-stage, HBT InGaP device optimized for high linearity and power efficiency. It contains all of the needed RF matching and DC biasing circuits. An in-module active bias circuit is included within the device for all three amplifier stages providing for excellent gain tracking over temperature and voltage variations. The first, second and output stages are independently supplied using the VCC1, VCC2 and VCC3 supply lines, pins 16, 14 and 11,respectively. The DC control voltage that sets the bias for all 3 stages is supplied via VC_BIAS, pin 4. The evaluation board includes shunt decoupling caps on these pins to suppress any possible bias affect on the RF at low frequencies. The bias reference voltages for stages 1, 2 and 3 are supplied using common lines VREF1, VREF2 and VREF3 (Pins 5, 6 and 7). The maximum reference voltage at the package pins is 4 V. Resistors R1, R2 and R3 on the evaluation board set the correct bias to these pins when attached to a 5 V power supply. The SKY65152 includes an internal PA Enable control pin (Pin 3) for fast RF On/Off control of < 0.5 s. Zero volts turns off the PA while 3-5 V will turn on the PA. The device also provides an output power detector voltage VDET at Pin 14. A bias voltage is required to operate the detector. The detector supply voltage is supplied via VCC_DET (Pin 15). The maximum voltage at the package pin is 4 V. Resistor R5 on the evaluation board sets the correct bias to this pin when attached to a 5 V power supply. Pin 18 is the RF input and Pin 9 is the RF output. External DC blocking or RF matching is not required on the RF input and output. Ground is achieved through several ground pins and the package backside, center ground. These features make the device suitable for wideband digital applications, where PA linearity and power consumption are of critical importance (e.g., WLANs). The device has been characterized with the highest specified data rates for 802.11b (11 Mbps) and 802.11g (54 Mbps). Under these stringent test conditions, the device exhibits excellent spectral purity and power efficiency.
pa_enB (pin 3). PA_ENB is the internal PA Enable control pin for fast RF On/Off control of < 0.5 s. Zero volts turns off the PA while 3-5 V will turn on the PA. VC_Bias (pin 4). VC_BIAS is the bias supply voltage for stages 1 and 2, typically set to 5 V. VreF1 (pin 5). Bias reference voltage for amplifier stage 1. VREF1 should be operated over the same voltage range as VCC, with a nominal voltage of 5 V. VreF2 (pin 6). Bias reference voltage for amplifier stage 2. VREF2 should be operated over the same voltage range as VCC, with a nominal voltage of 5 V. VreF3 (pin 7). Bias reference voltage for amplifier stage 3. VREF3 should be operated over the same voltage range as VCC, with a nominal voltage of 5 V. rF_OUt (pin 9). Amplifier RF Output Pin. ZO = 50 W. The module includes an onboard internal DC blocking capacitor. All impedance matching is provided internal to the module. VCC3 (pin 11). Supply voltage for the output (final) stage collector bias (typically 5 V). bypassing of VCC3 is accomplished with C10 and C17 and should be placed in the approximate location shown on the evaluation board, but placement is not critical. no Connect (pin 12). The pin is open and may or may not be connected to ground. VCC2 (pin 13). Supply voltage for the second stage collector bias (typically 5 V). Bypassing of VCC2 is accomplished with C8 and C16 and should be placed in the approximate location shown on the evaluation board, but placement is not critical. Vdet (pin 14). Output power detector voltage pin. The detector load and settling time constant are set external to the device. Inductor L2 and capacitor C7 are set to yield a settling time of less than 0.5 s. VCC_det (pin 15). Power detector supply voltage. Proper bias and bypassing is VCC_DET is accomplished with Resistor R5 and capacitor C5 provided. VCC_DET may be connected to PA_ENB supply. The benefit of doing this is the current draw consumed by the detector will not be wasted with the PA in the "Off" state. VCC1 (pin 16). Supply voltage for the first stage collector bias (typically 5 V). Bypassing of VCC1 is accomplished with C5 and C15 and should be placed in the approximate location shown on the evaluation board, but placement is not critical. rF_in (pin 18). Amplifier RF Input Pin. ZO = 50 W. The module includes an onboard internal DC blocking capacitor. All impedance matching is provided internal to the module.
Application Circuit Notes
Center Ground. It is extremely important that the device paddle be sufficiently grounded for both thermal and stability reasons. Multiple small vias are acceptable and will work well under the device if solder migration is an issue. Ground (pins 1, 2, 8, 10, 17, 19, 20). Attach all ground pins to the RF ground plane with the largest diameter and lowest inductance via that the layout will allow. Multiple small vias are also acceptable and will work well under the device if solder migration is an issue.
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200968 Rev. C * Skyworks Proprietary Information * Products and Product Information are Subject to Change Without Notice. * March 26, 2009
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preliminary Data Sheet * SKY65152
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. Please refer to Skyworks Solder Reflow application note, available at www.skyworksinc.com, for instructions on mounting the SKY65152 to a printed circuit board. Production quantities of this product are shipped in a standard tape and reel format. For packaging details, refer to the Skyworks Application Note, Tape and Reel, document number 101568.
Electrostatic Discharge (ESD) Sensitivity
The SKY65152 is a static-sensitive electronic device. Do not operate or store near strong electrostatic fields. Take proper ESD precautions.
Application Circuit
RF Input RF_In 18 C5 8.2 pF VCC1 16 15 14 13 12 11 C8 8.2 pF C15 10 F 21 20 19 17 Collector Voltage 1 (5 V)
GND
GND
GND
1 GND 2 PA Enable (0-5 V) 3 Bias Voltage (5 V) C11 10 F C1 3300 pF 4 5 6 R2 180 GND PA_ENB VC_BIAS VREF1
GND
VCC_DET VDET VCC2 NC RF_Out VCC3 10 GND
R5 300 L2 27 nH
Detector Supply Voltage (5 V) C6 3300 pF C7 8.2 pF C16 10 F
Detector Output Collector Voltage 2 (5 V)
Reference Voltage (5 V)
R1 680
VREF1
VREF2
GND
Collector Voltage 3 (5 V) C10 8.2 pF C17 10 F
7
8
R3 180 C2 3300 pF
9
RF Output
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preliminary Data Sheet * SKY65152
Pin Assignments
pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 name GND GND PA_ENB VC_BIAS VREF1 VREF2 VREF3 GND RF_OUT GND VCC3 NC VCC2 VDET VCC_DET VCC1 GND RF_IN GND GND Ground Ground PA ON/OFF control signal; OFF: 0 V to 0.5 V; ON: 3 V to VCC Bias voltage Bias reference voltage 1 Bias reference voltage 2 Bias reference voltage 3 Ground RF output Ground Stage 3 collector voltage No connection Stage 2 collector voltage Detector output signal Detector supply voltage Stage 1 collector voltage Ground RF input Ground Ground description
Center attachment pad must have a low inductance and low thermal resistance connection to the customer's printed circuit board ground plane.
Bill of Material for Evaluation Board
Component C1, C2, C6 C5, C7, C8, C10 C11, C15, C16, C17 L2 R1 R2, R3 R5 Value 3300 8.2 10 27 680 180 300 Units pF pF F nH W W W Qty. 3 4 4 1 1 2 1 size 0603 0603 0603 0603 0603 0603 0603 product number 5404R28-015 5404R98-010 5404R91-005 5332R34-030 5424R20-045 5424R20-031 5424R20-036 manufacturer Murata Murata TDK Taiyo-Yuden Rohm Rohm Rohm manufacturer's part number GRM188R71H332KD01J GRM1885C1H8R2CZ01D C3216X5R0J106KT HK160827NJ-T MCR03EZHUJ680 MCR03EZHUJ180 MCR03EZHUJ300 Characteristics X7R, 50 V, 10% C0G, 50 V, 0.25 pF X5R, 6 V, 10% 5%, SRF 2200 MHz 50 V, 0.063 W, 5% 50 V, 0.063 W, 5% 50 V, 0.063 W, 5%
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200968 Rev. C * Skyworks Proprietary Information * Products and Product Information are Subject to Change Without Notice. * March 26, 2009
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preliminary Data Sheet * SKY65152
Evaluation Board Description
The Skyworks SKY65152 Evaluation Board is used to test the performance of the SKY65152 power amplifier module. The following design considerations are general in nature and must be followed regardless of final use or configuration. 1. Paths to ground should be made as short as possible. 2. The ground pad of the SKY65152 power amplifier module has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit board acts as the heat sink, it must shunt as much heat as possible from the amplifiers. As such, design the connection to the ground pad to dissipate the maximum wattage produced to the circuit. Multiple vias to the grounding layer are required. 3. Bypass capacitors should be used on the DC supply lines. RF inductor is required on the Vcc supply line to block RF signal from the DC supply. See Evaluation Board schematic drawing for more details. 4. The RF lines should be well separated from each other, with solid ground in between traces, to maximize input-to-output isolation. NOTE: Junction temperature (TJ) of the device increases with a poor connection to the slug and ground. This reduces the lifetime of the device.
4. Connect a spectrum analyzer to the RF signal output port. 5. Enable the power supply. 6. Enable the RF signal. 7. Take measurements. CAUTION: If the input signal exceeds the rated power, the SKY65152 Evaluation Board can be permanently damaged. NOTE: It is important that the VCC voltage source be adjusted such that 5 V is measured at the board. The high collector currents will drop the collector voltage significantly if long leads are used. Adjust the bias voltage to compensate.
Evaluation Board
PA_ENB VC_BIAS VREF GND GND
VCC1 VCC_DET VDET VCC2 VCC3
Evaluation Board Test Procedure
Use the following procedure to set up the SKY65152 evaluation board for testing. 1. Connect a 5.0 V supply to VCC1, VCC2, VCC3, VREF1, VREF2, VREF3, VC_BIAS, VCC_DET, PA_ENB. If available, enable the current limiting function of the power supply of the VCC supply to 850 mA. 2. If desired, connect a voltage meter to VDET. 3. Connect a signal generator to the RF signal input port. Set it to the desired RF frequency at a power level of -15 dBm or less to the evaluation board, but do NOT enable the RF signal.
Recommended Solder Reflow Profiles
Refer to the "Recommended Solder Reflow Profile" Application Note.
Tape and Reel Information
Refer to the "Discrete Devices and IC Switch/Attenuators Tape and Reel Package Orientation" Application Note.
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preliminary Data Sheet * SKY65152
Evaluation Board Layer Detail
Evaluation Board Stack-up
Cross Section Name Thickness (mils) Material
L1 Lam1 L2_GND Lam2 L3_GND Lam3 L4 1.4 12 1.4 4 1.4 12 1.4 Cu
r
-
Rogers 4003-12 3.38 Cu, 1 oz. FR4-4 Cu, 1 oz. FR4-12 Cu, 1 oz. - 4.35 - 4.35 -
Layer 1: Silk Screen
Branding Specifications
Mark Pin 1 Identifier Manufacturing Part Number Revision Number
SKY65152-NP EXXXXX.XX YYWW MX
Lot Number YY = Manufacture Year WW = Week Packaged Sealed MX = Country Code
Layer 1: Top Metal
Layer 2 and 3: Ground
Layer 4: Backside Ground
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200968 Rev. C * Skyworks Proprietary Information * Products and Product Information are Subject to Change Without Notice. * March 26, 2009
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preliminary Data Sheet * SKY65152
Evaluation Board Layer Detail
Pin 1 Indicator 6 Top
Recommended Footprint
Thermal Via Array O0.3 mm On 0.6 mm Pitch Will Improve Thermal Performance Pin 20 Pin 1
6
13X 0.75 mm 0.25 mm Typ. 13X 0.5 mm
6.3 mm
1.45 0.1 12X 2.9 (2.075) 2X 1.9 4X 1.5 4X 0.5 Pin 20 (0.3) Solder Mask Opening O0.15 Metal Pad Pin 1 (2.75) Pin 1 4X 1.5 4X 0.5
0.6 mm Typ. 1 mm Typ.
4X 2.5
Package Outline 0.6 mm Typ. 6.3 mm
2X 1.9 8X 2.9 4X R0.2 Solder Mask Opening 0.5 0.1
A 20X SMT Pad
Solder Mask
Pin 20 Pin 1 20X 0.85 mm
0.1
20X 0.6 mm 2X 1.7 mm
0.5 0.05 Metal Pad Edge Detail A
6.4 mm 1 mm Typ.
All dimensions are in millimeters Dimensioning and tolerancing according to ASME Y14.5M-1994
Package Outline
2X 1.7 mm 6.4 mm
Stencil Pattern
Pin 20 Pin 1 20X 0.5 mm 2X 1.7 mm 6.3 mm 1 mm Typ. Stencil Aperture Size of 80 to 100% of the Module/Pkg. Solder Mask Opening 20X 0.75 mm
Package Outline 2X 1.7 mm 6.3 mm
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preliminary Data Sheet * SKY65152
Tape and Reel Dimensions
8.00 (P1) 0.3 0.02 Pin 1 1.75 0.10 O1.50 0.10 B 4.00 (Po) 2.00 0.05
5.50 0.05 A 6.35 (Bo) A 12.00 0.30
7 max O1.50 Min.
1.59 (Ko) Section B-B 6.35 (Ao) 8 Max.
B
Section A-A 1. Carrier tape: black conductive polystyrene 2. Cover tape material: transparent conductive PSA 3. Cover tape size: 9.3 mm width 4. All dimensions are in millimeters
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200968 Rev. C * Skyworks Proprietary Information * Products and Product Information are Subject to Change Without Notice. * March 26, 2009
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preliminary Data Sheet * SKY65152
Ordering Information
model name SKY65152: 2.4-2.5 GHz WLAN Power Amplifier manufacturing part number SKY65152-NP (Pb-free package) evaluation Kit part number TW17-D560-001
Copyright (c) 2008, 2009, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes. No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale. THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks, the Skyworks symbol, and "Breakthrough Simplicity" are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference.
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